Profile feature

Standard SnPb solder

Lead (Pb) free solder

Preheat

• Temperature min. (Tsmin)

100 °C

100 °C

• Temperature typ. (Tstyp)

120 °C

120 °C

• Temperature max. (Tsmax)

130 °C

130 °C

• Time (Tsmin to Tsmax) (ts)

70 seconds

70 seconds

D preheat to max Temperature

150 °C max.

150 °C max.

Peak temperature (TP)*

235 °C – 260 °C

250 °C – 260 °C

Time at peak temperature (tp)

6 seconds max

3 seconds max each wave

6 seconds max

3 seconds max each wave

Ramp-down rate

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

~ 2 K/s min

~3.5 K/s typ

~5 K/s max

Time 25 °C to 25 °C

4 minutes

4 minutes

Manual solder

Profile feature

Standard SnPb solder

Lead (Pb) free solder

Preheat and soak  • Temperature min. (Tsmin)

100 °C

150 °C

• Temperature max. (Tsmax)

150 °C

200 °C

• Time (Tsmin to Tsmax) (ts)

60-120 seconds

60-120 seconds

Ramp up rate TL to Tp

3 °C/ second max.

3 °C/ second max.

Liquidous temperature (TL)

183 °C

217 °C

Time (tL) maintained above TL

60-150 seconds

60-150 seconds

Peak package body temperature (TP)*

Table 1

Table 2

Time (tp)* within 5 °C of the specified classification temperature (Tc)

20 seconds*

30 seconds*

Ramp-down rate (Tp to TL)

6 °C/ second max.

6 °C/ second max.

Time 25 °C to peak temperature

6 minutes max.

8 minutes max.

* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.